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Crystal Growth Stage Assembly

A single crystal is pulled by liquid-encapsulated Czochralski (LEC) or grown by vertical gradient freeze (VGF), with molten boric oxide sealing the melt against phosphorus escape. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Build & assembly graph

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Bill of materials

4 top-level lines · 4 rows shown · 4 parts total · indented to 3 levels
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 pBN Crucible pbn-crucible 1 part
2 Boric Oxide Encapsulant boric-oxide-encapsulant 1 part
3 InP Seed Crystal inp-seed-crystal 1 part
4 InP Single-Crystal Boule inp-single-crystal-ingot 1 part

Parts list

4 positions · quantities are totals for one unit · standards per DIN/ISO where applicable
Pos.QtyUnitDesignationStandardMaterial / remark
11pcBoric Oxide EncapsulantB2O3, low-water
21pcInP Seed Crystal
31pcInP Single-Crystal BouleInP, S- or Fe-doped
41pcpBN CruciblePyrolytic BN

Used in 1 assembly

Sourcing — likely vendors

Companies that make this · indicative price $0.50–$100 · MOQ & lead are typical
VendorHQSpecialtyMOQLead time
🇨🇳Foxconn
foxconn.com ↗
Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
flex.com ↗ Singapore Electronics contract mfg 1,000 pcs 6–10 wks
dixoninfo.com ↗ Noida, IN Electronics contract mfg 1,000 pcs 6–10 wks
bydelectronic.com ↗ Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Venture Corp
venture.com.sg ↗
Singapore Electronics contract mfg 1,000 pcs 6–10 wks