Mold Die Set Assembly
Matched upper and lower mold dies shaped to shoe geometry, containing cooling passages. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Build & assembly graph
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Bill of materials
5 top-level lines · 5 rows shown · 6 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Upper Mold (Male Die) | sole-injection-machine-upper-mold | 1× | 1 | — | part |
| 2 | Lower Mold (Sole Cavity) | sole-injection-machine-lower-mold | 1× | 1 | — | part |
| 3 | Mold Cooling Coil | sole-injection-machine-mold-cooling-coil | 2× | 2 | — | part |
| 4 | Mold Clamp | sole-injection-machine-mold-clamp | 1× | 1 | — | part |
| 5 | Ejector Pin Set | sole-injection-machine-ejector-pin-set | 1× | 1 | — | part |
Used in 1 assembly
Sourcing — likely vendors
Companies that make this · indicative price $0.50–$100 · MOQ & lead are typical| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
| 🇨🇳Foxconn foxconn.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |