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Thermal Interface Pad Part

Silicone gap pad conducting heat from the board to the rear shell with 1–3 W/m·K conductivity. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Used in 1 assembly

LED Module

Sourcing — likely vendors

Companies that make this · indicative price $0.50–$100 · MOQ & lead are typical
VendorHQSpecialtyMOQLead time
🇨🇳Foxconn
foxconn.com ↗ 		Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Flex (Singapore)
flex.com ↗ 		Singapore Electronics contract mfg 1,000 pcs 6–10 wks
🇮🇳Dixon Technologies
dixoninfo.com ↗ 		Noida, IN Electronics contract mfg 1,000 pcs 6–10 wks
🇨🇳BYD Electronics
bydelectronic.com ↗ 		Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Venture Corp
venture.com.sg ↗ 		Singapore Electronics contract mfg 1,000 pcs 6–10 wks