Communications Payload Assembly
Bent-pipe transponder repeater: receive antennas, low-noise front end, frequency conversion, high-power amplification, channelization and transmit antennas. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
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Bill of materials
8 top-level lines · 29 rows shown · 258 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Receive Antenna Reflector | communications-satellite-rx-antenna | 2× | 2 | — | part |
| 2 | Feed Horn 3 parts | communications-satellite-feed-horn | 4× | 4 | 4 | assembly |
| 2.1 | Corrugated Horn Flare | communications-satellite-horn-flare | 1× | 4 | — | part |
| 2.2 | Orthomode Transducer | communications-satellite-omt | 1× | 4 | — | part |
| 2.3 | Connector | connector | 2× | 8 | — | part |
| 3 | Low-Noise Amplifier 3 parts | communications-satellite-lna | 4× | 4 | 4 | assembly |
| 3.1 | Bare PCB | pcb-bare | 1× | 4 | — | part |
| 3.2 | SMD Passive (R/C/L) | smd-passives | 1× | 4 | — | part |
| 3.3 | Connector | connector | 2× | 8 | — | part |
| 4 | Frequency Converter 4 parts | communications-satellite-frequency-converter | 4× | 4 | 5 | assembly |
| 4.1 | Bare PCB | pcb-bare | 1× | 4 | — | part |
| 4.2 | SMD Passive (R/C/L) | smd-passives | 1× | 4 | — | part |
| 4.3 | Microcontroller | mcu | 1× | 4 | — | part |
| 4.4 | Connector | connector | 2× | 8 | — | part |
| 5 | Output Multiplexer (OMUX) 2 parts | communications-satellite-output-multiplexer | 2× | 2 | 13 | assembly |
| 5.1 | Waveguide Channel Filter | communications-satellite-waveguide-filter | 12× | 24 | — | part |
| 5.2 | Combining Manifold | communications-satellite-manifold | 1× | 2 | — | part |
| 6 | Traveling-Wave Tube Amplifier 3 parts | communications-satellite-twta | 24× | 24 | 6 | assembly |
| 6.1 | Traveling-Wave Tube | communications-satellite-twt | 1× | 24 | — | part |
| 6.2 | Electronic Power Conditioner 3 parts | communications-satellite-epc | 1× | 24 | 3 | assembly |
| 6.2.1 | Bare PCB | pcb-bare | 1× | 24 | — | part |
| 6.2.2 | SMD Passive (R/C/L) | smd-passives | 1× | 24 | — | part |
| 6.2.3 | IGBT Power Module | igbt-module | 1× | 24 | — | part |
| 6.3 | Connector | connector | 2× | 48 | — | part |
| 7 | Solid-State Power Amplifier 3 parts | communications-satellite-sspa | 8× | 8 | 4 | assembly |
| 7.1 | Bare PCB | pcb-bare | 1× | 8 | — | part |
| 7.2 | SMD Passive (R/C/L) | smd-passives | 1× | 8 | — | part |
| 7.3 | Connector | connector | 2× | 16 | — | part |
| 8 | Transmit Antenna Reflector | communications-satellite-tx-reflector | 2× | 2 | — | part |
Used in 1 assembly
Sourcing — likely vendors
Companies that make this · indicative price $0.50–$100 · MOQ & lead are typical| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
| 🇨🇳Foxconn foxconn.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |