Electrical Power Subsystem Assembly
Generates, stores, regulates and distributes spacecraft power from deployable solar wings and a Li-ion battery. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Build & assembly graph
expand / collapse · shared sub-assemblies converge · links to related products · est. labour product / assembly shared across products atomic part related product
Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.
Bill of materials
4 top-level lines · 23 rows shown · 101 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Solar Array Wing 3 parts | communications-satellite-solar-wing | 2× | 2 | 8 | assembly |
| 1.1 | Solar Cell Panel | communications-satellite-solar-panel | 4× | 8 | — | part |
| 1.2 | Deployment Hinge | communications-satellite-deployment-hinge | 3× | 6 | — | part |
| 1.3 | Wire Bundle | wire-bundle | 1× | 2 | — | part |
| 2 | Solar Array Drive Mechanism 3 parts | communications-satellite-sadm | 2× | 2 | 23 | assembly |
| 2.1 | Stator Assembly 3 parts | stator-assembly | 1× | 2 | 3 | assembly |
| 2.1.1 | Stator Core (laminations) | stator-core | 1× | 2 | — | part |
| 2.1.2 | Copper Winding | copper-winding | 1× | 2 | — | part |
| 2.1.3 | Slot Insulation | stator-insulation | 1× | 2 | — | part |
| 2.2 | Rotor Assembly 4 parts | rotor-assembly | 1× | 2 | 19 | assembly |
| 2.2.1 | Rotor Shaft | rotor-shaft | 1× | 2 | — | part |
| 2.2.2 | Rotor Core | rotor-core | 1× | 2 | — | part |
| 2.2.3 | Neodymium Magnet | neodymium-magnet | 16× | 32 | — | part |
| 2.2.4 | Ball Bearing | ball-bearing | 1× | 2 | — | part |
| 2.3 | Slip Ring Assembly | communications-satellite-slip-ring | 1× | 2 | — | part |
| 3 | Li-ion Battery 2 parts | communications-satellite-battery | 1× | 1 | 33 | assembly |
| 3.1 | LiPo Cell | lipo-cell | 32× | 32 | — | part |
| 3.2 | BMS Board | bms-board | 1× | 1 | — | part |
| 4 | Power Conditioning Unit 4 parts | communications-satellite-pcu | 1× | 1 | 6 | assembly |
| 4.1 | Bare PCB | pcb-bare | 2× | 2 | — | part |
| 4.2 | IGBT Power Module | igbt-module | 2× | 2 | — | part |
| 4.3 | SMD Passive (R/C/L) | smd-passives | 1× | 1 | — | part |
| 4.4 | Microcontroller | mcu | 1× | 1 | — | part |
Used in 1 assembly
Sourcing — likely vendors
Companies that make this · indicative price $0.50–$100 · MOQ & lead are typical| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
| 🇨🇳Foxconn foxconn.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |