BOMwiki the bill-of-materials encyclopedia

DRAM Module Part

DDR3 or DDR4 soldered SO-DIMM, typically 1–4 GB, holding the OS, HMI application, and screen buffers. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Used in 1 assembly

CPU / SoC Module

Sourcing — likely vendors

Companies that make this · indicative price $0.50–$100 · MOQ & lead are typical
VendorHQSpecialtyMOQLead time
🇨🇳Foxconn
foxconn.com ↗ 		Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Flex (Singapore)
flex.com ↗ 		Singapore Electronics contract mfg 1,000 pcs 6–10 wks
🇮🇳Dixon Technologies
dixoninfo.com ↗ 		Noida, IN Electronics contract mfg 1,000 pcs 6–10 wks
🇨🇳BYD Electronics
bydelectronic.com ↗ 		Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Venture Corp
venture.com.sg ↗ 		Singapore Electronics contract mfg 1,000 pcs 6–10 wks