BOMwiki the bill-of-materials encyclopedia

CPU Heatsink Part

Aluminium or copper heatsink bonded to the SoC, with fins extending into the enclosure cavity; passive (no fan) up to 45 W dissipation. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Used in 1 assembly

Heat Dissipation

Sourcing — likely vendors

Companies that make this · indicative price $0.50–$100 · MOQ & lead are typical
VendorHQSpecialtyMOQLead time
🇨🇳Foxconn
foxconn.com ↗ 		Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Flex (Singapore)
flex.com ↗ 		Singapore Electronics contract mfg 1,000 pcs 6–10 wks
🇮🇳Dixon Technologies
dixoninfo.com ↗ 		Noida, IN Electronics contract mfg 1,000 pcs 6–10 wks
🇨🇳BYD Electronics
bydelectronic.com ↗ 		Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Venture Corp
venture.com.sg ↗ 		Singapore Electronics contract mfg 1,000 pcs 6–10 wks