Loader Module Assembly
Automatic FOUP interface and wafer shuttle mechanism for loading 25-150mm diameter wafers into the chuck. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Build & assembly graph
expand / collapse · shared sub-assemblies converge · links to related products · est. labour product / assembly shared across products atomic part related product
Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.
Bill of materials
4 top-level lines · 4 rows shown · 4 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Robotic Arm | wafer-prober-carrier-arm | 1× | 1 | — | part |
| 2 | FOUP Dock | wafer-prober-foup-interface | 1× | 1 | — | part |
| 3 | Linear Shuttle | wafer-prober-linear-shuttle | 1× | 1 | — | part |
| 4 | Blower Motor | blower-motor | 1× | 1 | — | part |
Used in 1 assembly
Sourcing — likely vendors
Companies that make this · indicative price $0.50–$100 · MOQ & lead are typical| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
| 🇨🇳Foxconn foxconn.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |