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Discussion: Wire Bonder

Product Automated tool that forms permanent electrical connections between semiconductor die bond pads and package leads by ultrasonically or thermally bonding gold or copper wire. · View page · History

This page is for disagreements and questions about Wire Bonder: a part that does not belong, a quantity that looks wrong, a photo that shows the wrong thing, a claim that needs evidence. Norms that emerge here become the house style; if discussion deadlocks, a reviewer or the admin decides. If you already know the fix, edit the page directly instead of asking permission. Comments are public and attributed to your profile.

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