Headphone Output Amplifier IC Assembly
Single-channel stereo headphone driver with 100–250 mW per channel. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Build & assembly graph
expand / collapse · shared sub-assemblies converge · links to related products · est. labour product / assembly shared across products atomic part related product
Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.
Bill of materials
4 top-level lines · 4 rows shown · 44 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Bare PCB | pcb-bare | 1× | 1 | — | part |
| 2 | Headphone Amp IC (250 mW stereo) | headphone-amp-hp-amp-ic | 1× | 1 | — | part |
| 3 | Output DC Blocking Capacitor | headphone-amp-output-coupling | 2× | 2 | — | part |
| 4 | SMD Passive (R/C/L) | smd-passives | 40× | 40 | — | part |
Used in 1 assembly
Sourcing — likely vendors
Companies that make this · indicative price $0.20–$50 · MOQ & lead are typical| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
| powersemi.cc ↗ | Jiaxing, CN | Power semiconductors (IGBT) | 1,000 pcs | 12–20 wks |
| 🇸🇬UTAC utacgroup.com ↗ | Singapore | Semiconductor assembly & test | 1,000 pcs | 12–20 wks |
| aseglobal.com ↗ | Singapore | Semiconductor packaging | 1,000 pcs | 12–20 wks |
| 🇨🇳SMIC smics.com ↗ | Shanghai, CN | Semiconductor foundry | 1,000 pcs | 12–20 wks |
| spel.com ↗ | Chennai, IN | Semiconductor assembly | 1,000 pcs | 12–20 wks |