Main Flex Circuit Assembly
Rigid-flex PCB curved around the ring circumference carrying the BLE SoC, memory, and power management. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
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Bill of materials
6 top-level lines · 6 rows shown · 65 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Rigid-Flex PCB | smart-ring-flex-pcb | 1× | 1 | — | part |
| 2 | BLE SoC | smart-ring-ble-soc | 1× | 1 | — | part |
| 3 | Buffer Flash Memory | smart-ring-flash | 1× | 1 | — | part |
| 4 | Power Management IC | smart-ring-pmic | 1× | 1 | — | part |
| 5 | BLE Antenna | smart-ring-antenna-trace | 1× | 1 | — | part |
| 6 | SMD Passive (R/C/L) | smd-passives | 60× | 60 | — | part |
Used in 1 assembly
Sourcing — likely vendors
Companies that make this · indicative price $0.50–$100 · MOQ & lead are typical| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
| 🇨🇳Foxconn foxconn.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |