BOMwiki the bill-of-materials encyclopedia 27,966,275 parts mapped · 127,489 items

Mainboard Assembly

Application SoC with neural accelerator, memory, and Wi-Fi/LTE connectivity for cloud or on-device translation. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Build & assembly graph

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Bill of materials

8 top-level lines · 8 rows shown · 257 parts total · indented to 3 levels
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Bare PCB pcb-bare 1 part
2 Compute SoC Module soc-module 1 part
3 LPDDR4 RAM pocket-translator-dram 1 part
4 eMMC Storage pocket-translator-emmc 1 part
5 Wi-Fi / Bluetooth Module pocket-translator-wifi-bt 1 part
6 LTE Modem pocket-translator-lte-modem 1 part
7 Power Management IC pocket-translator-pmic 1 part
8 SMD Passive (R/C/L) smd-passives 250× 250 part

Used in 1 assembly

Sourcing — likely vendors

Companies that make this · indicative price $1–$200 · MOQ & lead are typical
VendorHQSpecialtyMOQLead time
🇨🇳JLCPCB
jlcpcb.com ↗
Shenzhen, CN PCB fabrication 100 pcs 2–4 wks
🇨🇳PCBWay
pcbway.com ↗
Shenzhen, CN PCB fab & assembly 100 pcs 2–4 wks
scc.com.cn ↗ Shenzhen, CN PCB manufacturer 100 pcs 2–4 wks
shogini.com ↗ Mumbai, IN PCB manufacturer 100 pcs 2–4 wks
🇸🇬Venture Corp
venture.com.sg ↗
Singapore Electronics contract mfg 100 pcs 2–4 wks