Control System
AssemblyPLC cabinet with HMI touchscreen, servo drives, relays and process sensors coordinating the line. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Control System parts and their functions
6 top-level parts · 700 parts in total · full bill of materials below
| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | PLC Controller 4 parts | 1× | Programmable logic controller CPU plus motion coprocessor. |
| 2 | HMI Touchscreen 5 parts | 1× | Operator touchscreen |
| 3 | Servo Drive 4 parts | 4× | Servo amplifier driving a machine axis. |
| 4 | Relay | 12× | Electromechanical switch in which a small coil current closes or opens contacts rated for a much larger load, isolating control circuits from what they switch. |
| 5 | Process Sensor Set 3 parts | 1× | Field sensors monitoring level, pressure and bottle presence. |
| 6 | Control Cabinet | 1× | IP65 stainless control enclosure. |
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Bill of materials for Control System
6 top-level lines · 22 rows shown · 700 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | PLC Controller 4 parts | bottling-filler-plc | 1× | 1 | 163 | assembly |
| 1.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 1.2 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 1.3 | Microcontroller | mcu | 1× | 1 | · | part |
| 1.4 | SMD Passive (R/C/L) | smd-passives | 160× | 160 | · | part |
| 2 | HMI Touchscreen 5 parts | bottling-filler-hmi | 1× | 1 | 124 | assembly |
| 2.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2.2 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 2.3 | LCD Panel | lcd-panel | 1× | 1 | · | part |
| 2.4 | Touch Digitizer | touch-digitizer | 1× | 1 | · | part |
| 2.5 | SMD Passive (R/C/L) | smd-passives | 120× | 120 | · | part |
| 3 | Servo Drive 4 parts | bottling-filler-servo-drive | 4× | 4 | 98 | assembly |
| 3.1 | Bare PCB | pcb-bare | 1× | 4 | · | part |
| 3.2 | Microcontroller | mcu | 1× | 4 | · | part |
| 3.3 | Power MOSFET | mosfet | 6× | 24 | · | part |
| 3.4 | SMD Passive (R/C/L) | smd-passives | 90× | 360 | · | part |
| 4 | Relay | relay | 12× | 12 | · | part |
| 5 | Process Sensor Set 3 parts | bottling-filler-sensor-set | 1× | 1 | 8 | assembly |
| 5.1 | Pressure Sensor | pressure-sensor | 3× | 3 | · | part |
| 5.2 | Bottle Detect Sensor | bottling-filler-bottle-sensor | 4× | 4 | · | part |
| 5.3 | Level Probe | bottling-filler-level-probe | 1× | 1 | · | part |
| 6 | Control Cabinet | bottling-filler-control-cabinet | 1× | 1 | · | part |
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Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |