Crystal Growth Stage
AssemblyA single crystal is pulled by liquid-encapsulated Czochralski (LEC) or grown by vertical gradient freeze (VGF), with molten boric oxide sealing the melt against phosphorus escape. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Crystal Growth Stage parts and their functions
4 top-level parts · 4 parts in total · full bill of materials below
| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | pBN Crucible | 1× | Pyrolytic boron nitride melt vessel |
| 2 | Boric Oxide Encapsulant | 1× | B2O3 glass layer over the melt |
| 3 | InP Seed Crystal | 1× | Oriented <100> seed |
| 4 | InP Single-Crystal Boule | 1× | Grown boule, 2–4 inch diameter |
3D model
No 3D model yet. Have a CAD file of this? Add a 3D model. STL renders right on this page; STEP, FreeCAD, and OpenSCAD sources are welcome too (openly licensed, like all 3D models on BOMwiki).
Build & assembly graph
expand / collapse · shared sub-assemblies converge · links to related products · est. labour
product / assembly
shared across products
atomic part
related product
Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.
Bill of materials for Crystal Growth Stage
4 top-level lines · 4 rows shown · 4 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | pBN Crucible | pbn-crucible | 1× | 1 | · | part |
| 2 | Boric Oxide Encapsulant | boric-oxide-encapsulant | 1× | 1 | · | part |
| 3 | InP Seed Crystal | inp-seed-crystal | 1× | 1 | · | part |
| 4 | InP Single-Crystal Boule | inp-single-crystal-ingot | 1× | 1 | · | part |
Something wrong in this list? Report a problem with this BOM.
Where the crystal growth stage is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |