Wafering Stage
AssemblyThe boule is ground to diameter, sliced, and polished; InP is brittle, so yields and handling losses matter more than for silicon. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Wafering Stage
2 top-level lines as of r88278| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Wire-Saw Slicing | wafer-wire-saw-slice | 1× | 1 | · | part |
| 2 | Polished Epi-Ready Wafer | inp-polished-wafer | 1× | 1 | · | part |