Wire-Saw Slicing
PartDiamond wire slices the boule into ~350–650 µm wafers; kerf loss is reclaimed where economics allow. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Diamond wire slices the boule into ~350–650 µm wafers; kerf loss is reclaimed where economics allow. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.