CPU Assembly
Sourcing — likely vendors
Real suppliers (🇮🇳 🇸🇬 🇨🇳); price, MOQ & lead time are estimates| Vendor | HQ | Specialty | Est. unit price | MOQ | Lead time |
|---|---|---|---|---|---|
| 🇨🇳Foxconn foxconn.com ↗ | Shenzhen, CN | Electronics contract mfg | $3.09 | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | $3.12 | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | $4.47 | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | $4.68 | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | $4.71 | 1,000 pcs | 6–10 wks |
Multi-core desktop processor: silicon die on a substrate under an integrated heat spreader. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Build & assembly graph
expand / collapse · shared sub-assemblies converge · links to related products · est. labour product / assembly shared across products atomic part related product
Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.
Bill of materials
3 top-level lines · 3 rows shown · 3 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | CPU Die | desktop-pc-cpu-die | 1× | 1 | — | part |
| 2 | CPU Substrate | desktop-pc-cpu-substrate | 1× | 1 | — | part |
| 3 | Integrated Heat Spreader | desktop-pc-ihs | 1× | 1 | — | part |