Heating Element Supply
AssemblyPower conditioning and feedback loop maintaining thermal head setpoint within ±2 °C. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Heating Element Supply
4 top-level lines as of r171955| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Thermal Fuse | thermal-fuse | 1× | 1 | · | part |
| 2 | Thermistor Network | thermal-stencil-printer-thermistor-network | 1× | 1 | · | part |
| 3 | Power MOSFET | mosfet | 1× | 1 | · | part |
| 4 | SMD Passive (R/C/L) | smd-passives | 2× | 2 | · | part |