Thermal Print Head
AssemblyResistive heating element array (64–128 elements) melting stencil adhesive at 160–200 °C contact temperature. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Thermal Print Head
4 top-level lines as of r171951| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Heating Resistor Array | thermal-stencil-printer-heating-resistor-array | 1× | 1 | · | part |
| 2 | Heat Sink | thermal-stencil-printer-heat-sink | 1× | 1 | · | part |
| 3 | Thermistor Sensor | thermal-stencil-printer-thermistor-sensor | 1× | 1 | · | part |
| 4 | Head Cable | thermal-stencil-printer-head-cable | 1× | 1 | · | part |