Processor and DSP Unit
AssemblyA real-time processor combining data from all sensors (5–10 lasers + encoder) to build a 3D point cloud of the tread surface, detecting cupping, worn patches, and circumferential or lateral variation. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Processor and DSP Unit
7 top-level lines as of r173437| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | DSP Processor | tts-dsp-module | 1× | 1 | · | part |
| 2 | Camera Interface | tts-camera-interface | 1× | 1 | · | part |
| 3 | Encoder Input | tts-encoder-input | 1× | 1 | · | part |
| 4 | RAM Buffer | tts-data-buffer | 1× | 1 | · | part |
| 5 | SSD Storage | tts-ssd-storage | 1× | 1 | · | part |
| 6 | SMD Passive (R/C/L) | smd-passives | 20× | 20 | · | part |
| 7 | Thermal Fuse | thermal-fuse | 1× | 1 | · | part |