Thermal Pad
PartThermal epoxy (3–5 W/mK) bonding the LED PCB directly to the stainless steel heatsink backing. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Thermal epoxy (3–5 W/mK) bonding the LED PCB directly to the stainless steel heatsink backing. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.