COB LED Package
PartChip-on-board LED module bonding many dies under a phosphor layer for a dense, high-lumen source. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Chip-on-board LED module bonding many dies under a phosphor layer for a dense, high-lumen source. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.