Thermal Pad
PartSilicone-based interface material (3–5 W/mK) bonded between PCB and aluminum heatsink. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Silicone-based interface material (3–5 W/mK) bonded between PCB and aluminum heatsink. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.