Thermal Interface
PartHigh-conductivity silicone TIM pad (3–5 W/mK) compressed between substrate and aluminum frame back-plate. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
High-conductivity silicone TIM pad (3–5 W/mK) compressed between substrate and aluminum frame back-plate. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.