Thermal Interface Pad
PartSilicone gap pad conducting heat from the board to the rear shell with 1–3 W/m·K conductivity. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Silicone gap pad conducting heat from the board to the rear shell with 1–3 W/m·K conductivity. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.