Power Subsystem
AssemblyGeneration and storage: deployable solar arrays charge a lithium battery, and a power-control unit distributes regulated buses to every load. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Power Subsystem parts and their functions
5 top-level parts · 447 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Solar Array 3 parts | 2× | Deployable solar arrays |
| 2 | Lithium Battery 3 parts | 1× | Lithium-ion battery |
| 3 | Power Control Unit 4 parts | 1× | Power control and distribution unit |
| 4 | Array Drive | 2× | Solar-array drive mechanisms |
| 5 | Wire Bundle | 1× | Power harness |
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Bill of materials for Power Subsystem
5 top-level lines · 18 rows shown · 447 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Solar Array 3 parts | plnd-solar-array | 2× | 2 | 9 | assembly |
| 1.1 | Solar Panel | plnd-solar-panel | 4× | 8 | · | part |
| 1.2 | Array Hinge | plnd-array-hinge | 3× | 6 | · | part |
| 1.3 | Deploy Spring | plnd-deploy-spring | 2× | 4 | · | part |
| 2 | Lithium Battery 3 parts | plnd-battery | 1× | 1 | 107 | assembly |
| 2.1 | Space Li-ion Cell | plnd-battery-cell | 24× | 24 | · | part |
| 2.2 | Battery Management Unit 3 parts | plnd-bms | 1× | 1 | 82 | assembly |
| 2.2.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 2.2.2 | Microcontroller | mcu | 1× | 1 | · | part |
| 2.2.3 | SMD Passive (R/C/L) | smd-passives | 80× | 80 | · | part |
| 2.3 | Battery Housing | plnd-battery-housing | 1× | 1 | · | part |
| 3 | Power Control Unit 4 parts | plnd-pcdu | 1× | 1 | 319 | assembly |
| 3.1 | Bare PCB | pcb-bare | 2× | 2 | · | part |
| 3.2 | Microcontroller | mcu | 1× | 1 | · | part |
| 3.3 | Relay | relay | 16× | 16 | · | part |
| 3.4 | SMD Passive (R/C/L) | smd-passives | 300× | 300 | · | part |
| 4 | Array Drive | plnd-array-drive | 2× | 2 | · | part |
| 5 | Wire Bundle | wire-bundle | 1× | 1 | · | part |
Where the power subsystem is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |