Science Instrument Module
AssemblyFramework behind the primary mirror carrying the imaging and spectroscopic instruments plus the fine guidance sensor, all operating near 40 K. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Science Instrument Module parts and their functions
5 top-level parts · 34 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Near-Infrared Camera 3 parts | 1× | Near-infrared camera |
| 2 | Multi-Object Spectrograph 3 parts | 1× | Multi-object spectrograph |
| 3 | Mid-Infrared Instrument 3 parts | 1× | Mid-infrared instrument |
| 4 | Fine Guidance Sensor | 1× | Fine guidance sensor |
| 5 | Mid-IR Cryocooler | 1× | Mid-IR cryocooler |
3D model
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Build & assembly graph
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Bill of materials for Science Instrument Module
5 top-level lines · 14 rows shown · 34 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Near-Infrared Camera 3 parts | space-telescope-nir-camera | 1× | 1 | 16 | assembly |
| 1.1 | HgCdTe Detector Array | space-telescope-hgcdte-array | 10× | 10 | · | part |
| 1.2 | Lens Assembly | camera-lens | 4× | 4 | · | part |
| 1.3 | Bare PCB | pcb-bare | 2× | 2 | · | part |
| 2 | Multi-Object Spectrograph 3 parts | space-telescope-spectrograph | 1× | 1 | 8 | assembly |
| 2.1 | Microshutter Array | space-telescope-microshutter | 4× | 4 | · | part |
| 2.2 | HgCdTe Detector Array | space-telescope-hgcdte-array | 2× | 2 | · | part |
| 2.3 | Bare PCB | pcb-bare | 2× | 2 | · | part |
| 3 | Mid-Infrared Instrument 3 parts | space-telescope-mir-instrument | 1× | 1 | 8 | assembly |
| 3.1 | Si:As Detector Array | space-telescope-sias-array | 3× | 3 | · | part |
| 3.2 | Lens Assembly | camera-lens | 3× | 3 | · | part |
| 3.3 | Bare PCB | pcb-bare | 2× | 2 | · | part |
| 4 | Fine Guidance Sensor | space-telescope-guidance-sensor | 1× | 1 | · | part |
| 5 | Mid-IR Cryocooler | space-telescope-cryocooler | 1× | 1 | · | part |
Where the science instrument module is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |