AI Compute Module
AssemblySystem-on-module pairing CPU cores with a GPU/NPU accelerator delivering tens of TOPS, with its own LPDDR memory and power-management stage on a dense ten-plus-layer board. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for AI Compute Module
7 top-level lines as of r53241| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 2 | LPDDR5 Memory | edge-ai-box-lpddr | 1× | 1 | · | part |
| 3 | Boot eMMC | edge-ai-box-emmc | 1× | 1 | · | part |
| 4 | Module PMIC | edge-ai-box-module-pmic | 1× | 1 | · | part |
| 5 | Module Connector | edge-ai-box-board-connector | 2× | 2 | · | part |
| 6 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 7 | SMD Passive (R/C/L) | smd-passives | 280× | 280 | · | part |