Sensor Module
AssemblyThe capture element: a capacitive sensor die or optical imager behind a hard platen surface converts the ridge-valley pattern of a pressed fingertip into a grayscale image. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Sensor Module
5 top-level lines as of r63165| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Capacitive Sensor Die | fingerprint-reader-sensor-die | 1× | 1 | · | part |
| 2 | CMOS Image Sensor | image-sensor | 1× | 1 | · | part |
| 3 | Touch Platen | fingerprint-reader-platen | 1× | 1 | · | part |
| 4 | ESD Ring | fingerprint-reader-esd-ring | 1× | 1 | · | part |
| 5 | Sensor Flex | fingerprint-reader-sensor-flex | 1× | 1 | · | part |