GPU Package
AssemblyThe graphics processor: a large parallel die flip-chip mounted on a package substrate. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for GPU Package
2 top-level lines as of r76809| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | GPU Die | graphics-card-gpu-die | 1× | 1 | · | part |
| 2 | Package Substrate | graphics-card-gpu-substrate | 1× | 1 | · | part |