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Electronics Unit

Assembly

The shaft-mounted module that generates transmit pulses, amplifies and samples the receive signal, and runs the detection and ground-compensation algorithms. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Electronics Unit parts and their functions

6 top-level parts · 289 parts in total · full bill of materials below
Electronics Unit parts diagram: 1 pulse driver, 2 receive front-end, 3 DSP board, 4 control panel, 5 electronics enclosure, 6 connector. 289 parts in 6 top-level items.
Electronics Unit parts diagram. Numbers match the table below; each box is one top-level part or assembly with what it contains.
#PartQtyWhat it does
1 Pulse Driver 3 parts 1× Power stage that switches several amperes through the transmit coil and clamps the hundreds-of-volts flyback at turn-off.
2 Receive Front-End 3 parts 1× Low-noise amplifier and gated sampler that digitizes the eddy-current decay curve microseconds after each pulse.
3 DSP Board 4 parts 1× Processor that fits decay curves, subtracts the soil response, and maps target strength to audio pitch and volume.
4 Control Panel 3 parts 1× Sealed membrane keypad and indicators for power, sensitivity, and ground-compensation balancing.
5 Electronics Enclosure 1× IP67 polymer case clamped to the shaft, shock-mounted to survive parachute drops and -30 to +55 °C.
6 Connector 3× Mating plug-and-socket pair that joins two lengths of wiring or a cable to a board so a circuit can be assembled, serviced, and separated without soldering.

3D model

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Build & assembly graph

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Bill of materials for Electronics Unit

6 top-level lines · 19 rows shown · 289 parts total · indented to 3 levels
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Pulse Driver 3 parts mine-detector-pulse-driver 1× 1 65 assembly
1.1 Power MOSFET mosfet 4× 4 · part
1.2 Bare PCB pcb-bare 1× 1 · part
1.3 SMD Passive (R/C/L) smd-passives 60× 60 · part
2 Receive Front-End 3 parts mine-detector-rx-frontend 1× 1 93 assembly
2.1 Bare PCB pcb-bare 1× 1 · part
2.2 SMD Passive (R/C/L) smd-passives 90× 90 · part
2.3 Connector connector 2× 2 · part
3 DSP Board 4 parts mine-detector-dsp-board 1× 1 124 assembly
3.1 Microcontroller mcu 1× 1 · part
3.2 Bare PCB pcb-bare 1× 1 · part
3.3 SMD Passive (R/C/L) smd-passives 120× 120 · part
3.4 Connector connector 2× 2 · part
4 Control Panel 3 parts mine-detector-control-panel 1× 1 3 assembly
4.1 Membrane Keypad mine-detector-keypad 1× 1 · part
4.2 LCD Panel lcd-panel 1× 1 · part
4.3 Bare PCB pcb-bare 1× 1 · part
5 Electronics Enclosure mine-detector-enclosure 1× 1 · part
6 Connector connector 3× 3 · part

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Where the electronics unit is used

1 product across 1 domain contain it, directly or inside a sub-assembly

Used in 1 assembly

Sourcing: possible vendors

Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work
VendorHQSpecialtyMOQLead time
🇨🇳Foxconn
foxconn.com ↗
Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
flex.com ↗ Singapore Electronics contract mfg 1,000 pcs 6–10 wks
dixoninfo.com ↗ Noida, IN Electronics contract mfg 1,000 pcs 6–10 wks
bydelectronic.com ↗ Shenzhen, CN Electronics contract mfg 1,000 pcs 6–10 wks
🇸🇬Venture Corp
venture.com.sg ↗
Singapore Electronics contract mfg 1,000 pcs 6–10 wks