Mainboard
AssemblyConformal-coated system board with soldered memory and wide-temperature parts, qualified from −29 to +63 °C operating. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Mainboard
8 top-level lines as of r147234| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 2 | Soldered Memory | ruggedized-field-laptop-memory-down | 1× | 1 | · | part |
| 3 | Conformal Coating | ruggedized-field-laptop-conformal-coating | 1× | 1 | · | part |
| 4 | TPM Module | ruggedized-field-laptop-tpm-module | 1× | 1 | · | part |
| 5 | Wireless Module | ruggedized-field-laptop-wireless-module | 2× | 2 | · | part |
| 6 | Bare PCB | pcb-bare | 2× | 2 | · | part |
| 7 | SMD Passive (R/C/L) | smd-passives | 1× | 1 | · | part |
| 8 | Power MOSFET | mosfet | 12× | 12 | · | part |