BOMwiki the bill-of-materials encyclopedia
30,454,201 parts mapped · 193,225 items

You are viewing r147255 of this page, not the current version. Go to current · history

Thermal System

Assembly

Sealed-case cooling that conducts CPU heat to the magnesium shell, with a gasketed-fan variant for higher-power configurations. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.

Bill of materials for Thermal System

5 top-level lines as of r147255
# Item / sub-assembly Part no. Qty/assy Ext. qty Parts Type
1 Heat Pipe Set ruggedized-field-laptop-heat-pipe-set 2× 2 · part
2 Chassis Spreader ruggedized-field-laptop-chassis-spreader 1× 1 · part
3 Sealed Fan ruggedized-field-laptop-sealed-fan 1× 1 · part
4 Heater Mat ruggedized-field-laptop-heater-mat 1× 1 · part
5 Thermal Sensor Set ruggedized-field-laptop-thermal-sensors 1× 1 · part