Baseband Unit (BBU)
AssemblyOverview
The Baseband Unit (BBU) is the indoor digital heart of the gNodeB. Housed in a climate-controlled cabinet, it performs all layer-1 and control-plane processing and connects the radio to the transport network heading toward the 5G core.
Construction
A sheet-metal BBU Chassis with a passive backplane holds the cards. Two Baseband Processing Board units run the PHY: each carries a DSP/SoC, an acceleration FPGA for channel coding and beamforming math, and DDR4 Memory Module banks. The Fronthaul Optical Interface mounts pluggable SFP+ Optical Module optics and frames I/Q samples into eCPRI for the fiber link to the AAU. A Switch Fabric Board board moves packets between cards over the backplane, and the Control Board runs the gNodeB control plane and OAM. Two Fan Module trays and redundant power supplies keep the shelf running through component failures.
Baseband Unit (BBU) parts and their functions
8 top-level parts · 57 parts in total · full bill of materials below
| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | BBU Chassis 3 parts | 1× | Card-cage chassis |
| 2 | Baseband Processing Board 6 parts | 2× | Baseband processing boards |
| 3 | Fronthaul Optical Interface 5 parts | 1× | eCPRI optical interface |
| 4 | Switch Fabric Board 4 parts | 1× | Backplane switch fabric |
| 5 | Control Board 5 parts | 1× | Control/management board |
| 6 | Fan Module 3 parts | 2× | Cooling fan modules |
| 7 | Power Supply | 2× | Redundant PSUs |
| 8 | Wire Bundle | 1× | Internal harness |
3D model
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Build & assembly graph
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Bill of materials for Baseband Unit (BBU)
8 top-level lines · 34 rows shown · 57 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | BBU Chassis 3 parts | cell-base-station-bbu-chassis | 1× | 1 | 7 | assembly |
| 1.1 | Sheet Metal Panel | sheet-panel | 4× | 4 | · | part |
| 1.2 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 1.3 | Fastener Set | fastener-set | 2× | 2 | · | part |
| 2 | Baseband Processing Board 6 parts | cell-base-station-baseband-board | 2× | 2 | 10 | assembly |
| 2.1 | Bare PCB | pcb-bare | 1× | 2 | · | part |
| 2.2 | Compute SoC Module | soc-module | 1× | 2 | · | part |
| 2.3 | FPGA | cell-base-station-fpga | 1× | 2 | · | part |
| 2.4 | Memory Module | cell-base-station-memory-module | 4× | 8 | · | part |
| 2.5 | SMD Passive (R/C/L) | smd-passives | 1× | 2 | · | part |
| 2.6 | Connector | connector | 2× | 4 | · | part |
| 3 | Fronthaul Optical Interface 5 parts | cell-base-station-fronthaul-board | 1× | 1 | 8 | assembly |
| 3.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 3.2 | SFP+ Optical Module | cell-base-station-sfp-module | 4× | 4 | · | part |
| 3.3 | FPGA | cell-base-station-fpga | 1× | 1 | · | part |
| 3.4 | SMD Passive (R/C/L) | smd-passives | 1× | 1 | · | part |
| 3.5 | Connector | connector | 1× | 1 | · | part |
| 4 | Switch Fabric Board 4 parts | cell-base-station-switch-fabric | 1× | 1 | 5 | assembly |
| 4.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 4.2 | Switch ASIC | cell-base-station-switch-asic | 1× | 1 | · | part |
| 4.3 | SMD Passive (R/C/L) | smd-passives | 1× | 1 | · | part |
| 4.4 | Connector | connector | 2× | 2 | · | part |
| 5 | Control Board 5 parts | cell-base-station-control-board | 1× | 1 | 6 | assembly |
| 5.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 5.2 | Microcontroller | mcu | 1× | 1 | · | part |
| 5.3 | Compute SoC Module | soc-module | 1× | 1 | · | part |
| 5.4 | SMD Passive (R/C/L) | smd-passives | 1× | 1 | · | part |
| 5.5 | Connector | connector | 2× | 2 | · | part |
| 6 | Fan Module 3 parts | cell-base-station-fan-module | 2× | 2 | 4 | assembly |
| 6.1 | Blower Motor | blower-motor | 2× | 4 | · | part |
| 6.2 | Sheet Metal Panel | sheet-panel | 1× | 2 | · | part |
| 6.3 | Connector | connector | 1× | 2 | · | part |
| 7 | Power Supply | power-supply | 2× | 2 | · | part |
| 8 | Wire Bundle | wire-bundle | 1× | 1 | · | part |
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Where the baseband unit (BBU) is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
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