Thermal Management
AssemblyAluminum heatsink radiating CPU and modem power dissipation, enabling -30°C to 70°C operation. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Thermal Management
2 top-level lines as of r88827| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Passive Aluminum Heatsink | industrial-cellular-router-heatsink | 1× | 1 | · | part |
| 2 | Graphite Thermal Interface | industrial-cellular-router-thermal-pad | 2× | 2 | · | part |