Chassis and Thermal
Assembly2RU rackmount enclosure with front QSFP28 ports, rear power/management, and active cooling for 500W dissipation. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Chassis and Thermal
5 top-level lines as of r114441| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | 2RU Rackmount Chassis | network-packet-broker-chassis-frame | 1× | 1 | · | part |
| 2 | Copper-Aluminum Heatsink | network-packet-broker-heatsink-assy | 2× | 2 | · | part |
| 3 | Redundant Fan Module | network-packet-broker-fan-module | 2× | 2 | · | part |
| 4 | AC Power Inlet | network-packet-broker-power-inlet | 1× | 1 | · | part |
| 5 | Fastener Set | fastener-set | 2× | 2 | · | part |