Cooling System
AssemblyPassive heatsink dissipating 30–50 W from FPGA/ASIC and PA modules, maintaining safe die temperatures. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Cooling System
3 top-level lines as of r140346| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Baseband Heatsink | remote-radio-head-cpu-heatsink | 1× | 1 | · | part |
| 2 | PA Heatsink | remote-radio-head-pa-heatsink | 1× | 1 | · | part |
| 3 | Thermal Interface Material | remote-radio-head-thermal-interface | 1× | 1 | · | part |