Thermal Management
AssemblyCPU and ASIC heatsinks, with optional active cooling for high-throughput deployments. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Thermal Management
4 top-level lines as of r150534| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | CPU Passive Heatsink | sd-wan-appliance-cpu-heatsink | 1× | 1 | · | part |
| 2 | ASIC Mini Heatsink | sd-wan-appliance-asic-heatsink | 1× | 1 | · | part |
| 3 | Graphite Thermal Pads | sd-wan-appliance-thermal-pads | 3× | 3 | · | part |
| 4 | 40 mm Cooling Fan | sd-wan-appliance-fan-optional | 1× | 1 | · | part |