Thermal Management
AssemblyHeatsinks mounted to power amplifier and baseband SoC, with active fan cooling for hot climates. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Thermal Management
4 top-level lines as of r157726| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | PA Copper-Aluminum Heatsink | small-cell-basestation-pa-heatsink | 1× | 1 | · | part |
| 2 | Baseband Passive Heatsink | small-cell-basestation-baseband-heatsink | 1× | 1 | · | part |
| 3 | 120 mm Axial Cooling Fan | small-cell-basestation-cooling-fan | 1× | 1 | · | part |
| 4 | Graphite Thermal Pad | small-cell-basestation-thermal-interface | 3× | 3 | · | part |