Thermal Compound
PartSilicone-based thermal interface material, 3–4 W/m·K conductivity, applied to MMIC-to-sink interface. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Silicone-based thermal interface material, 3–4 W/m·K conductivity, applied to MMIC-to-sink interface. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.