Thermal Management
AssemblyPassive or active heat dissipation maintaining die temperature within safe limits during continuous operation. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Thermal Management
3 top-level lines as of r174671| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Heatsink | tower-mounted-amplifier-heatsink | 1× | 1 | · | part |
| 2 | Thermal Compound | tower-mounted-amplifier-thermal-compound | 1× | 1 | · | part |
| 3 | Vent Slots | tower-mounted-amplifier-vent-slots | 1× | 1 | · | part |