Thermal Management Skid
AssemblyLiquid cooling skid circulating coolant to rack cold plates and the PCS to hold cells near 25 °C. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Thermal Management Skid parts and their functions
8 top-level parts · 97 parts in total · full bill of materials below
| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Coolant Chiller | 1× | Refrigerant chiller cooling the coolant loop |
| 2 | Coolant Pump | 2× | Redundant coolant circulation pumps |
| 3 | Rack Cold Plate | 8× | Cold plate per battery rack |
| 4 | Coolant Manifold | 1× | Supply and return distribution manifold |
| 5 | Coolant Hose | 16× | Insulated coolant hoses |
| 6 | Expansion Tank | 1× | Coolant expansion and fill tank |
| 7 | Pressure Sensor | 2× | Coolant loop pressure sensors |
| 8 | Thermal Controller 4 parts | 1× | Thermal management controller |
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Bill of materials for Thermal Management Skid
8 top-level lines · 12 rows shown · 97 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Coolant Chiller | battery-energy-storage-container-chiller | 1× | 1 | · | part |
| 2 | Coolant Pump | battery-energy-storage-container-coolant-pump | 2× | 2 | · | part |
| 3 | Rack Cold Plate | battery-energy-storage-container-cold-plate | 8× | 8 | · | part |
| 4 | Coolant Manifold | battery-energy-storage-container-coolant-manifold | 1× | 1 | · | part |
| 5 | Coolant Hose | battery-energy-storage-container-coolant-hose | 16× | 16 | · | part |
| 6 | Expansion Tank | battery-energy-storage-container-expansion-tank | 1× | 1 | · | part |
| 7 | Pressure Sensor | pressure-sensor | 2× | 2 | · | part |
| 8 | Thermal Controller 4 parts | battery-energy-storage-container-thermal-control | 1× | 1 | 66 | assembly |
| 8.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 8.2 | Microcontroller | mcu | 1× | 1 | · | part |
| 8.3 | Relay | relay | 4× | 4 | · | part |
| 8.4 | SMD Passive (R/C/L) | smd-passives | 60× | 60 | · | part |
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Where the thermal management skid is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |