Thermal Management
AssemblyHeat exchanger, chiller, and HVAC keeping the electrolyte between 10 and 40 degrees C and cooling power electronics. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Thermal Management parts and their functions
7 top-level parts · 13 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Plate Heat Exchanger | 2× | Titanium plate heat exchanger cooling electrolyte |
| 2 | Glycol Chiller | 1× | Glycol chiller unit rejecting waste heat |
| 3 | Coolant Pump | 1× | Glycol coolant circulation pump |
| 4 | Container HVAC Unit | 1× | Container HVAC for cabinet temperature control |
| 5 | Temperature Sensor | 6× | RTD sensors on tanks, stacks, and electronics |
| 6 | Heating Element | 1× | Electrolyte trace heater for cold-climate startup |
| 7 | Pressure Sensor | 1× | Coolant loop pressure sensor |
3D model
No 3D model yet. Have a CAD file of this? Add a 3D model. STL renders right on this page; STEP, FreeCAD, and OpenSCAD sources are welcome too (openly licensed, like all 3D models on BOMwiki).
Build & assembly graph
expand / collapse · shared sub-assemblies converge · links to related products · est. labour
product / assembly
shared across products
atomic part
related product
Tap an assembly to expand/collapse · tap a part to open it · use “Open page” for any node · drag to pan, scroll to zoom.
Bill of materials for Thermal Management
7 top-level lines · 7 rows shown · 13 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Plate Heat Exchanger | grid-energy-storage-flow-heat-exchanger | 2× | 2 | · | part |
| 2 | Glycol Chiller | grid-energy-storage-flow-chiller | 1× | 1 | · | part |
| 3 | Coolant Pump | grid-energy-storage-flow-coolant-pump | 1× | 1 | · | part |
| 4 | Container HVAC Unit | grid-energy-storage-flow-hvac-unit | 1× | 1 | · | part |
| 5 | Temperature Sensor | grid-energy-storage-flow-temp-sensor | 6× | 6 | · | part |
| 6 | Heating Element | heating-element | 1× | 1 | · | part |
| 7 | Pressure Sensor | pressure-sensor | 1× | 1 | · | part |
Something wrong in this list? Report a problem with this BOM.
Where the thermal management is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |