Power Module
AssemblyThree-phase switching bridge converting DC to AC, built from SiC MOSFET or IGBT modules with DC link energy storage. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Power Module parts and their functions
8 top-level parts · 41 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | SiC Power Module | 6× | SiC MOSFET half-bridge power modules, two per phase leg |
| 2 | Gate Driver Board | 6× | Isolated gate driver boards with desaturation protection |
| 3 | DC Link Capacitor | 12× | Film DC link capacitors for ripple current handling |
| 4 | Laminated Busbar Stack | 1× | Low-inductance laminated busbar interconnecting modules |
| 5 | Power Module Cold Plate | 3× | Liquid cold plates clamping the power modules, one per phase |
| 6 | Snubber Network | 6× | RC snubber networks across each switch |
| 7 | Module Clamp | 6× | Spring clamps maintaining thermal interface pressure |
| 8 | Fastener Set | 1× | Torqued bolts and washers for module and busbar mounting |
3D model
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Build & assembly graph
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Bill of materials for Power Module
8 top-level lines · 8 rows shown · 41 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | SiC Power Module | grid-forming-inverter-sic-module | 6× | 6 | · | part |
| 2 | Gate Driver Board | grid-forming-inverter-gate-driver | 6× | 6 | · | part |
| 3 | DC Link Capacitor | grid-forming-inverter-dc-link-cap | 12× | 12 | · | part |
| 4 | Laminated Busbar Stack | grid-forming-inverter-busbar-stack | 1× | 1 | · | part |
| 5 | Power Module Cold Plate | grid-forming-inverter-cold-plate | 3× | 3 | · | part |
| 6 | Snubber Network | grid-forming-inverter-snubber | 6× | 6 | · | part |
| 7 | Module Clamp | grid-forming-inverter-module-clamp | 6× | 6 | · | part |
| 8 | Fastener Set | fastener-set | 1× | 1 | · | part |
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Where the power module is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |