Cooling Plate
PartDirect-bonded copper or aluminum base soldered to IGBT module, 10–30 kW dissipation capacity. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Direct-bonded copper or aluminum base soldered to IGBT module, 10–30 kW dissipation capacity. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.