Heat Dissipation
AssemblyPassive heatsink and thermal interface dissipating CPU and power-stage losses to the mounting bracket. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Heat Dissipation
3 top-level lines as of r82547| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | CPU Heatsink | hmi-touch-panel-heatsink | 1× | 1 | · | part |
| 2 | Thermal Interface Pad | hmi-touch-panel-thermal-pad | 1× | 1 | · | part |
| 3 | Heatsink Mounting Bracket | hmi-touch-panel-case-interface | 1× | 1 | · | part |