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CPU Heatsink

Part

Aluminium or copper heatsink bonded to the SoC, with fins extending into the enclosure cavity; passive (no fan) up to 45 W dissipation.

Class	Part

Aluminium or copper heatsink bonded to the SoC, with fins extending into the enclosure cavity; passive (no fan) up to 45 W dissipation. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.