Thermal Interface Pad
PartPhase-change material (1–3 W/m·K) bonded between SoC and heatsink, surviving 10,000 thermal cycles. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Phase-change material (1–3 W/m·K) bonded between SoC and heatsink, surviving 10,000 thermal cycles. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.