Heatsink Chassis
AssemblyDie-cast or extruded aluminum rear housing whose external fins are the only cooling: the SoC conducts its heat through a thermal pad straight into the case. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Bill of materials for Heatsink Chassis
5 top-level lines as of r89139| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Finned Rear Casting | industrial-panel-pc-finned-rear | 1× | 1 | · | part |
| 2 | Thermal Pad | industrial-panel-pc-thermal-pad | 2× | 2 | · | part |
| 3 | Heat Spreader | industrial-panel-pc-heat-spreader | 1× | 1 | · | part |
| 4 | I/O Plate | industrial-panel-pc-io-plate | 1× | 1 | · | part |
| 5 | Fastener Set | fastener-set | 1× | 1 | · | part |