Ear Cup Assembly
AssemblyHousing, dynamic driver, acoustic damping, ear pad, baffle, and touch panel. A full specification article for this item is being written. Meanwhile its bill of materials and connections are below.
Ear Cup Assembly parts and their functions
11 top-level parts · 36 parts in total · full bill of materials below| # | Part | Qty | What it does |
|---|---|---|---|
| 1 | Ear Cup Housing | 1× | Molded outer cup shell. |
| 2 | Dynamic Driver 4 parts | 1× | Dynamic driver |
| 3 | Driver Baffle | 1× | Driver mounting baffle |
| 4 | Acoustic Mesh & Damping | 2× | Mesh + damping felt |
| 5 | Ear Pad Memory Foam | 1× | Memory-foam cushion |
| 6 | Ear Pad Cover | 1× | Protein-leather cover |
| 7 | Touch Control Panel 2 parts | 1× | Capacitive control surface |
| 8 | ANC Microphone | 2× | Feedforward + feedback mics |
| 9 | Call Microphone | 1× | Beamforming call mic |
| 10 | Wire Bundle | 1× | Inter-cup signal wiring |
| 11 | Fastener Set | 1× | Bolts, nuts, and washers. |
3D model
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Build & assembly graph
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Bill of materials for Ear Cup Assembly
11 top-level lines · 17 rows shown · 36 parts total · indented to 3 levels| # | Item / sub-assembly | Part no. | Qty/assy | Ext. qty | Parts | Type |
|---|---|---|---|---|---|---|
| 1 | Ear Cup Housing | studio-headphones-cup-housing | 1× | 1 | · | part |
| 2 | Dynamic Driver 4 parts | studio-headphones-driver | 1× | 1 | 4 | assembly |
| 2.1 | Speaker | speaker | 1× | 1 | · | part |
| 2.2 | Neodymium Magnet | neodymium-magnet | 1× | 1 | · | part |
| 2.3 | Voice Coil | studio-headphones-voice-coil | 1× | 1 | · | part |
| 2.4 | Driver Diaphragm | studio-headphones-diaphragm | 1× | 1 | · | part |
| 3 | Driver Baffle | studio-headphones-baffle | 1× | 1 | · | part |
| 4 | Acoustic Mesh & Damping | studio-headphones-acoustic-mesh | 2× | 2 | · | part |
| 5 | Ear Pad Memory Foam | studio-headphones-ear-pad-foam | 1× | 1 | · | part |
| 6 | Ear Pad Cover | studio-headphones-ear-pad-cover | 1× | 1 | · | part |
| 7 | Touch Control Panel 2 parts | studio-headphones-touch-panel | 1× | 1 | 21 | assembly |
| 7.1 | Bare PCB | pcb-bare | 1× | 1 | · | part |
| 7.2 | SMD Passive (R/C/L) | smd-passives | 20× | 20 | · | part |
| 8 | ANC Microphone | studio-headphones-anc-mic | 2× | 2 | · | part |
| 9 | Call Microphone | studio-headphones-call-mic | 1× | 1 | · | part |
| 10 | Wire Bundle | wire-bundle | 1× | 1 | · | part |
| 11 | Fastener Set | fastener-set | 1× | 1 | · | part |
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Where the ear cup assembly is used
1 product across 1 domain contain it, directly or inside a sub-assemblyUsed in 1 assembly
Sourcing: possible vendors
Browse the supplier directory → Prices, MOQ, and lead times are algorithmic estimates, not quotes, and not claims about these companies. Company mappings are curated by keyword; est. price band $0.50–$100. How estimates work| Vendor | HQ | Specialty | MOQ | Lead time |
|---|---|---|---|---|
|
🇨🇳Foxconn
foxconn.com ↗
|
Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| flex.com ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| dixoninfo.com ↗ | Noida, IN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| bydelectronic.com ↗ | Shenzhen, CN | Electronics contract mfg | 1,000 pcs | 6–10 wks |
| venture.com.sg ↗ | Singapore | Electronics contract mfg | 1,000 pcs | 6–10 wks |